The Pan Pacific Microelectronics Symposium promotes international technical interchange and provides a premier forum for networking among microelectronics professionals and business leaders throughout the world.
The Pan Pac technical committee has finalized the program for the 2019 Symposium. In addition to several inspiring keynotes, this program features ground-breaking research from global experts on Processing Technologies, Advanced Process, Advanced Design, Cleaning, Harsh Environments Requirements, Materials Technology, Trends in Advanced Packaging & Interconnects, X-Ray, Inspection, and more.