
STI Electronics Engineering
Manufacturing Services
- Contract Assembly: Customized assembly solutions tailored to meet specific requirements.
- Prototype Development: Accelerate development with our rapid prototyping services.
- New Product Introduction (NPI) Builds: Specialize in efficiently transitioning new products to high-volume production.
- Design for Manufacturing (DFM): Optimize designs for improved manufacturing quality and cost-efficiency.
Electronics manufacturing services designed to take your products from initial design through full-scale production, ensuring quality, efficiency, and scalability.
STI Electronics (SMT & PCB / IPC)
Training & Certifications
- Hands-on Skills Development: Foster a strong workforce with practical, hands-on training in electronics assembly.
- Creative Training Solutions: Customized training courses tailored from commercial to high-reliability standards.
- IPC Authorized Training Center: Instructor and Operator level training for IPC courses including the J-STD-001 and IPC/WHMA-A-620 Space.
- Flexible Training Locations: Courses available at STI’s facilities in Alabama and Texas, or onsite at your location.
STI Electronics, Inc. is a leading provider of comprehensive solder and electronic assembly training, designed to enhance skills and meet the stringent requirements of the industry.
Training Classes + Services
IPC 7711/7721 Certified IPC Specialist (CIS) Rework/Repair and Modification Certification Program/Lecture &Hands-On
IPC 7711/7721 Certified IPC Specialist (CIS) Rework/Repair and Modification Certification Program/Lecture &Hands-On
$1,900.00
This class provides skill-based training regarding rework, repair and modification procedures covered in the IPC-7711 and IPC-7721 documents. This is a hands-on course. Module one is mandatory and consists of Common procedures. Modules 2-10 consist of; Wire Splicing Procedures, Conformal Coating, Through Hole component removal and installation, Chip and MELF removal and installation, Gull Wing removal and installation, J-lead removal and installation, BGA (Lecture only/Optional), Laminate Repair, and Circuit Repair. An open book exam is required after Module 1. Recertification is required every 2 years.
Description
This class provides skill-based training regarding rework, repair and modification procedures covered in the IPC-7711 and IPC-7721 documents. This is a hands-on course. Module one is mandatory and consists of Common procedures. Modules 2-10 consist of; Wire Splicing Procedures, Conformal Coating, Through Hole component removal and installation, Chip and MELF removal and installation, Gull Wing removal and installation, J-lead removal and installation, BGA (Lecture only/Optional), Laminate Repair, and Circuit Repair. An open book exam is required after Module 1. Recertification is required every 2 years.
IPC 7711/7721 Certified IPC Trainer (CIT) Recertification Program/Lecture Hands-On
IPC 7711/7721 Certified IPC Trainer (CIT) Recertification Program/Lecture Hands-On
$2,010.00
Description
This program is for anyone needing to renew their existing IPC-7711/7721 CIT Certification. This is a hands-on course. Section one is mandatory and consists of Common procedures. Sections 2-10 consist of; Wire Splicing Procedures, Conformal Coating, Through Hole component removal and installation, Chip and MELF removal and installation, Gull Wing removal and installation, J-lead removal and installation, BGA (Lecture only), Laminate Repair, and Circuit Repair. An open book and closed book exam is required. Recertification is required every 2 years.
IPC 7711/7721 Certified IPC Specialist (CIS) Rework/Repair and Modification Recertification Program/Lecture & Hands-On
IPC 7711/7721 Certified IPC Specialist (CIS) Rework/Repair and Modification Recertification Program/Lecture & Hands-On
$1,010.00
Description
This program is for anyone needing to renew their existing IPC-7711/7721 CIS Certification. This is a hands-on course. The CIS class is modularized to allow you to choose only the modules needed. Module one is mandatory and consists of Common procedures. Modules 2-10 consist of; Wire Splicing Procedures, Conformal Coating, Through Hole component removal and installation, Chip and MELF removal and installation, Gull Wing removal and installation, J-lead removal and installation, BGA (Lecture only), Laminate Repair, and Circuit Repair. An open book exam is required after Module 1. Recertification is required every 2 years.

WE ARE AN
AUTHORIZED TRAINING CENTER
More Services...
Engineering and Design Services
Advanced circuit design, microelectronics, and environmental testing to meet precise customer specifications.
Testing & Quality Assurance
Rigorous testing protocols and quality assurance measures employed to maintain the highest standards of product reliability and performance.

Rework and Repair Services
Enhance or restore electronic assemblies, emphasizing precision and compliance with industry standards.
Materials, Supplies & Training Kits
Our comprehensive range of high-quality kits and components, ideal for both training and practical electronics projects.









