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An Class 1000/ISO Class 6 cleanroom provides the optimum environment for for prototype and low volume microelectronics manufacturing and assembly production. Assembly materials such as printed circuit boards (PCBs), components, and wire are stored in dry nitrogen cabinets to reduce contamination and degradation. A sophisticated dispenser/placement machine is used for low volume dispense accuracy and repeatability in addition to ±10μm component placement. Component pick options include waffle pack and wafer for high-precision SMT and bare die, including flip chip assembly. Wire bond interconnect is accomplished with a fully automatic ultrasonic wedge bonder utilizing aluminum wire over a wide diameter range for low and high current applications. A two-channel mass flow controller plasma system is employed to prepare surfaces for die attach, wire bonding, and encapsulation. Material qualification and process control are accomplished via a bond tester coupled with high magnification visual inspection.
• ISO 14644-1 Certification to ISO Class 6
• Controlled Temperature/Humidity Environment
• Ionizer/Dissipative Flooring ESD Control