IPC-A-600 Certified IPC Trainer (CIT) Certification/Recertification Program/ Lecture Based
This course utilizes the images in the IPC-A-600 document to provide visual accept/reject criteria examples for all three classes of bare board fabrication and inspection. The IPC-A-600, “The Acceptability of Printed Boards”, describes the preferred, acceptable, and nonconforming conditions that are either externally or internally observable on printed boards. The CIT program will familiarize the student with IPC-A-600 “Acceptability of Printed Boards” document to include Introduction and Cleanliness Testing, Externally Observable Characteristics, Internally Observable Characteristics and Miscellaneous Flexible and Rigid-Flex Printed Boards, and Metal Core and Flush Printed Boards. Open book and closed book exams are required. Recertification is required every 2 years.
IPC-A-600 Certified IPC Specialist (CIS) Training Certification/Recertification Program/ Lecture Based
This course utilizes the images in the IPC-A-600 document to provide visual accept/reject criteria examples for all three classes of bare board fabrication and inspection. The IPC-A-600, “The Acceptability of Printed Boards”, describes the preferred, acceptable, and nonconforming conditions that are either externally or internally observable on printed boards. The CIS program is modularized and will familiarize the student with IPC-A-600 “Acceptability of Printed Boards” document to include Introduction and Cleanliness Testing, Externally Observable Characteristics, Internally Observable Characteristics and Miscellaneous (Flexible and Rigid-Flex Printed Boards, and Metal Core and Flush Printed Boards. Open book exams are required after each module. Recertification is required every 2 years.
IPC J-STD-001H CERTIFIED IPC TRAINER (CIT) RECERTIFICATION PROGRAM/Lecture & Hands-On
This program provides an in-depth look at the J-STD-001 document. The course reviews this document and helps students learn how to interpret the criteria. Section 1 is an introduction to the process requirements of J-STD-001, Section 2 focuses on wires and terminals, Section 3 covers PCB, Coating, Encapsulation and Staking, Section 4 emphasizes Through-Hole Technology, Section 5 emphasizes Surface Mount Technology and Section 6 focuses on Inspection, Inspection Methodology, and Process Control. Open book and closed book exams are. Sections 2, 4 and 5 include hands-on training. Recertification required every 2 years. CIT's are qualified to teach Certified IPC Application Specialist (CIS) training and certification programs.
IPC J-STD-001H CERTIFIED IPC TRAINER (CIT) CERTIFICATION PROGRAM/Lecture & Hands-On
This program provides an in-depth look at the J-STD-001 document. The course reviews this document and helps students learn how to interpret the criteria. Section 1 is an introduction to the process requirements of J-STD-001, Section 2 focuses on wires and terminals, Section 3 covers PCB, Coating, Encapsulation and Staking, Section 4 emphasizes Through-Hole Technology, Section 5 emphasizes Surface Mount Technology and Section 6 focuses on Inspection, Inspection Methodology, and Process Control. Open book and closed book exams are. Sections 2, 4 and 5 include hands-on training. Recertification required every 2 years. CIT's are qualified to teach Certified IPC Application Specialist (CIS) training and certification programs.
IPC 7711/7721 Certified IPC Trainer (CIT) Recertification Program/Lecture & Hands-On
This program is for anyone needing to renew their existing IPC-7711/7721 CIT Certification. This is a hands-on course. Section one is mandatory and consists of Common procedures. Sections 2-10 consist of; Wire Splicing Procedures, Conformal Coating, Through Hole component removal and installation, Chip and MELF removal and installation, Gull Wing removal and installation, J-lead removal and installation, BGA (Lecture only), Laminate Repair, and Circuit Repair. An open book and closed book exam is required. Recertification is required every 2 years.
IPC 7711/7721 Certified IPC Specialist (CIS) Rework/Repair and Modification Recertification Program/Lecture & Hands-On
This program is for anyone needing to renew their existing IPC-7711/7721 CIS Certification. This is a hands-on course. The CIS class is modularized to allow you to choose only the modules needed. Module one is mandatory and consists of Common procedures. Modules 2-10 consist of; Wire Splicing Procedures, Conformal Coating, Through Hole component removal and installation, Chip and MELF removal and installation, Gull Wing removal and installation, J-lead removal and installation, BGA (Lecture only), Laminate Repair, and Circuit Repair. An open book exam is required after Module 1. Recertification is required every 2 years.
IPC 7711/7721 Certified IPC Specialist (CIS) Rework/Repair and Modification Certification Program/Lecture & Hands-On
This class provides skill-based training regarding rework, repair and modification procedures covered in the IPC-7711 and IPC-7721 documents. This is a hands-on course. Module one is mandatory and consists of Common procedures. Modules 2-10 consist of; Wire Splicing Procedures, Conformal Coating, Through Hole component removal and installation, Chip and MELF removal and installation, Gull Wing removal and installation, J-lead removal and installation, BGA (Lecture only/Optional), Laminate Repair, and Circuit Repair. An open book exam is required after Module 1. Recertification is required every 2 years.
Cable/Harness 100
This course is an introduction to Cable/Harness Assembly and Soldering. Topics include Common Terms and Definitions, Fundamentals of Crimping, such as Wire Preparation, Wire Stripping/ Tinning. Crimp Contracts (Stamped/Formed, and Machined), Pull Test, Wires and Terminals (Wire Preparation, Wrap and Solder Requirements as well as Inspection will be covered.
Basic Soldering/Lecture & Hands-On
The Basic Soldering Course is modularized curriculum that can be customized to fit your company requirements. Training modules include component identification, electrostatic discharge, tools and equipment, materials, preparing to solder, wires and terminals, through-hole soldering, SMT soldering, localized cleaning, and basic through-hole and SMT rework.