STI helps customers understand their layout parameters, processing challenges, component selections, laminate materials, and enclosure materials. These decisions, in some cases, can be quite detailed and considered a multi-variable analysis. To this end, STI provides evaluation services combined with custom design of experiments (DOE) to help guide engineers to sound design and processing choices. STI creates a custom DOE that is co-developed with the customer’s design engineers to gather the data necessary to understand those multi-variable issues. STI’s approach is to create a DOE that gathers data to develop a full understanding of the interrelationship of the variables as well as the ability to replicate the variable sets. This ensures a full understanding of the impacts of a multi-variable problem.

The DOE is a custom designed test protocol to gather and quantify the data into a format that enables a decision to be reached on the problem at hand. STI utilizes the assets of its multi-disciplined departments to develop these unique DOEs that aid in defining and understanding the complex relationship between material choices, component selections, board design layout, processing materials (i.e. flux selection, alloy composition, etc), as well as their impact on the assembly process and reliability of the final product. These variables all play a role in the product’s performance and its ability to meet the design objective and warranty expectations. Examples of variables to be considered in a customized DOE are as follows:

• Flux type and alloy composition for solder interconnects: Careful consideration of flux type and alloy composition ensures optimal soldering performance and long-term reliability of interconnects.
• Cleaning requirements: Understanding and implementing appropriate cleaning procedures is crucial for maintaining product integrity and performance.
• Component selection: Thoughtful component selection is key to meeting performance requirements and ensuring compatibility within the system.
• Layout requirements: Attention to layout requirements facilitates efficient assembly processes and minimizes potential issues during production.
• Laminate choice and PCB layout design: Selecting the right laminate and designing the PCB layout correctly are essential for achieving desired electrical performance and reliability.
• Processing requirements: Adhering to specific processing requirements is critical for consistent product quality and reliability.
• Processing aids: Utilizing appropriate processing aids enhances manufacturing efficiency and ensures consistent product quality.
• Enclosure requirements: Proper enclosure design is essential for protecting electronics from environmental factors and ensuring long-term durability.
• Harsh environment design guidelines: Following harsh environment design guidelines helps mitigate risks and ensures product reliability in challenging operating conditions.
• Reliability and warranty expectation: Meeting reliability standards and warranty expectations is essential for customer satisfaction and long-term success in the market.