STI Electronics Engineering
Specialized Testing Services
STI Electronics, Inc.'s Engineering Department provides an extensive range of test services tailored to the aerospace, military, and commercial electronics industries. By offering customized test protocols and adhering to various industry standards, STI ensures precise and reliable testing outcomes for both component-level and system-level electronics hardware.
Key Testing Services Offered by STI Electronics:
- Environmental Test Services: Evaluates electronics under varying environmental conditions to ensure durability and functionality.
- Electrical Test Services: Assesses the electrical characteristics and performance of electronic components and systems to ensure they meet specified criteria.
- Mechanical Test Services: Tests the physical and mechanical properties of electronics to verify strength, durability, and operational functionality.
- Thermography Test Services: Utilizes infrared technology to detect heat patterns and areas of heat elevation which can indicate potential faults in electronic components.
- Strain Gage Test Services: Measures the strain on electronic components under various conditions to assess their structural integrity and performance under stress.
By performing these tests in compliance with EIA/JEDEC, IEC, AEC, ASTM, IPC, and MIL standards, STI Electronics, Inc. guarantees that the testing services not only meet but exceed the rigorous requirements of the aerospace, military, and commercial sectors. This comprehensive approach ensures the reliability, safety, and efficiency of the electronics, fostering trust and satisfaction among STI's diverse clientele.
STI Electronics Engineering
Electrical Test Services
STI provides comprehensive electrical test services that range from detailed component-level testing and characterization to complete system-level evaluations. These services are designed to validate and ensure that electronic components and systems meet both the manufacturers’ performance specifications and the custom requirements set by customers.
Key Electrical Test Services Provided by STI:
- Component-Level Testing: Assesses individual components for functionality and performance against specified parameters.
- Passive Parametric Testing: Evaluates passive electronic components like resistors and capacitors to ensure they meet all specified criteria.
- Discrete Failure Simulation: Simulates failures in discrete components to identify potential issues and validate component robustness.
- IC Voltage/Current Analysis: Analyzes integrated circuits for correct voltage and current operation to prevent performance degradation.
- System-Level Testing: Conducts tests on assembled electronic systems to ensure overall system functionality and compliance with specifications.
- Troubleshooting/Debugging: Identifies and resolves issues within electronic circuits and systems to enhance reliability and performance.
- Failure Analysis: Investigates the root causes of electronic failures to improve future designs and prevent recurrence.
- Insulation Resistance Testing: Measures the insulation resistance of electronic components to ensure their capability to withstand voltage and prevent electrical leaks.
- IPC-TM-650: Utilizes the standard test methodologies specified in IPC-TM-650 to ensure consistency and reliability in testing.
- HIPOT Testing (up to 1000 V): High voltage test to check dielectric strength and electrical insulation capacities of products.
- Cable Assemblies: Specialized testing for cable assemblies to ensure reliability and performance under specified conditions.
- Printed Circuit Boards: Conducts thorough testing of PCBs to verify their electrical functionality and durability.
- Circuit Card Assemblies: Ensures that assembled circuit cards operate as intended under expected use conditions.
- Data Acquisition: Gathers and analyzes data from electronic systems to evaluate performance under test conditions.
- Voltage Monitoring: Monitors voltage levels throughout the testing process to ensure stability and correct operation.
- Temperature Monitoring: Keeps track of temperature changes in devices under test to identify potential overheating issues.
Through these extensive testing services, STI ensures that all electrical components and systems perform optimally and reliably, adhering to industry standards and customer expectations. This rigorous approach helps to safeguard the quality and reliability of electronic products in various applications.
STI Electronics Engineering
Environmental Test Services
Understanding the vulnerabilities of electronic hardware to environmental factors like moisture, temperature, and contaminants, STI emphasizes the importance of thorough reliability testing and test-to-failure methodologies. These tests are crucial for ensuring that electronic products can withstand real-world environmental conditions, thus reducing the risk of field failures and associated costs.
Key Environmental Test Services Provided by STI:
- Thermal Shock: Tests the ability of electronic components to withstand sudden changes in temperature, which can cause mechanical failure due to thermal stress.
- Temperature Cycling: Exposes products to varying temperatures to ensure they can endure and operate throughout the range of expected temperature conditions.
- Moisture Resistance: Evaluates the resistance of electronic components to moisture, assessing their durability in humid or wet conditions.
- Humidity Cycling: Cycles humidity levels to test the products' ability to handle high humidity, which can affect performance and longevity.
- Shelf Life: Determines how long a product can be stored under specified environmental conditions before it begins to degrade.
- Accelerated Aging: Uses elevated conditions of stress, such as temperature and humidity, to simulate the long-term effects of aging in a shorter period, predicting the product's lifespan and reliability.
By utilizing advanced temperature and humidity test chambers and in-situ electrical testing capabilities, STI ensures that all electronic products are rigorously evaluated against specified environmental conditions. This strategic approach not only enhances product reliability but also helps maintain long-term profitability by minimizing warranty claims and enhancing customer satisfaction.
STI Electronics Engineering
Mechanical Test Services
STI's mechanical test services are designed to meticulously characterize assembly materials and assess the integrity of manufacturing processes. These services are crucial for validating the mechanical robustness of electronic components, particularly focusing on both first-level and second-level interconnects.
Key Mechanical Test Services Provided by STI:
- Bond Strength (Destructive): Evaluates the maximum force a bond can withstand before failure, providing critical data on the material’s mechanical robustness.
- Nondestructive Bond Pull: Tests the strength of wire bonds and other connections under stress conditions without causing damage, ensuring ongoing functionality and reliability.
- Die Shear Strength: Measures the shear force that a semiconductor die can withstand before detachment occurs, critical for assessing the robustness of die attachments.
- Solder Bump Shear Strength: Determines the shear strength of solder bumps used in ball grid arrays (BGAs), chip-scale packages (CSPs), and wafer-level packaging solder points (WSPs), essential for evaluating the mechanical integrity of these solder connections.
By offering these specialized mechanical testing capabilities, STI ensures that all aspects of a device’s mechanical construction are rigorously tested for durability and reliability. This comprehensive testing helps in predicting potential failures and enhances the overall quality and trustworthiness of electronic assemblies.
STI Electronics Engineering
Thermography Test Services
STI utilizes thermal infrared (IR) imaging to provide crucial insights into the thermal management of electronic assemblies. This advanced testing method is integral for characterizing how effectively an assembly dissipates heat and for pinpointing the peak junction temperatures of components, which are vital for optimizing assembly designs and material selections.
Key Thermography Test Services Provided by STI:
- Assembly Thermal Profiling: Maps the temperature distribution across an entire assembly, helping to assess overall thermal dissipation and identify hot spots that may affect functionality and longevity.
- Component Tj (Junction Temperature) Analysis: Focuses on measuring the maximum temperature at the semiconductor junction of components, crucial for ensuring that temperatures remain within safe operational limits.
- Electronics Failure Analysis: Uses IR imaging to detect overheating issues and identify failing components or circuits, whether in a laboratory setting or deployed in the field.
By employing thermography test services, STI enhances the design and thermal management strategies of electronics, ensuring components operate within their thermal limits and reducing the risk of heat-related failures. This proactive approach not only improves product reliability but also aids in the troubleshooting and refinement of existing electronic assemblies.
STI Electronics Engineering
Strain Gage Test Services
STI employs strain gage testing to critically evaluate how materials and manufacturing processes influence stress on printed wiring boards (PWBs) and components. This type of testing is essential for assessing the effects of static and dynamic loads, which can arise from thermal, mechanical, or combined sources.
Key Strain Gage Test Services Provided by STI:
- Strain Gage Rosette Selection: Choosing the appropriate strain gage rosettes for the specific testing requirements, ensuring accurate stress measurement under various conditions.
- Rosette Attachment and Wiring: Expertly attaching and wiring the strain gages to the test specimen to capture precise data on how the material or component reacts under stress.
- Data Acquisition with Thermal Correlation: Gathering and analyzing stress and strain data while correlating these measurements with thermal conditions to better understand the environmental impact on material behavior.
- Stress/Strain Analysis: Detailed analysis of the stress and strain data to identify potential risk areas that could lead to microfractures or other types of failures if not mitigated.
Through these specialized services, STI helps to identify and eliminate potential stress issues that could compromise the assembly yield and long-term reliability of electronic assemblies. Addressing these stress factors proactively is vital for enhancing the durability and performance of electronic products, ultimately reducing field returns and increasing customer satisfaction.
STI Electronics Engineering
Informational Brochure -Download
