Ultrasonic / Thermasonic Wire Bond

• Design & Manufacturing
  • Contract Assembly
  • Prototype Development
  • New Product Introduction (NPI) Builds
  • Process Development
  • Box Build & Test
  • Feasibility Assessment
  • Experimental Design and Processing (Electronics DOE)
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  • Conflict Minerals Policy Statement
  • SeaPort-e
• Material Failure Analysis
  • Qualification Testing
  • Visual Inspection / IPC Compliance
  • Scanning Electron Microscope (SEM) / Energy Dispersive Spectroscopy (EDS)
  • Ion Chromatography
  • Transmission X-Ray Evaluation
  • Micro-sectional Analysis
  • XRF – Plating Thickness Evaluation
  • Wetting Balance Testing
  • FTIR – Organic Contamination Testing
  • Dye and Pry Testing
  • Supply Chain Validation
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• Microelectronics Packaging
  • Microelectronics Assembly
  • Imbedded Die Engineering (IC/DT®)
  • Ultrasonic / Thermasonic Wire Bond
  • Flip Chip Assembly
  • Thermal Optimization
  • Cleanroom (Class 1000/ISO Class 6)
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• Circuit Design
  • Schematic Forward Design
  • PCB Layout & Design
  • System Level Integration
  • Size, Weight & Power Reduction
  • Design for Manufacturing (DFM)
  • Material Optimization
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• Test Services
  • Electrical Test Services
  • Environmental Test Services
  • Mechanical Test Services
  • Thermography Test Services
  • Strain Gage Test Services
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• Applications